TSL2569T【PDF 35/37 页】IC LIGHT TO DGTL CONV 6-TMB

TSL2568, TSL2569

LIGHT-TO-DIGITAL CONVERTER

TAOS091D DECEMBER 2008

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the release and

vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the

package molding compound contains the smallest amount of absorbed moisture possible, each device is

dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica

gel to protect them from ambient moisture during shipping, handling, and storage before use.

The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under

the following conditions:

Temperature Range

5癈 to 50癈

Relative Humidity

60% maximum

Floor Life

1 year out of bag at ambient < 30癈 / 60% RH

Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,

it should be done at 90癈 for 3 hours.

The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under

the following conditions:

Temperature Range

5癈 to 50癈

Relative Humidity

60% maximum

Total Time

6 months from the date code on the aluminized envelope if unopened

Opened Time

168 hours or fewer

Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized

envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90癈 for 4 hours.

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